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1

Tin (Sn) Recovery from Wave Soldering Lead Free Solder Dross via Hydrochloric Acid Leaching and Combustion Treatment

Ismail, Syarifah Aminah, Jamil, Noorina Hidayu, Hussin, Kamarudin, Mohd Salleh, Mohd Arif Anuar

Journal:

Materials Science Forum

Année:

2016

Langue:

english

Fichier:

PDF, 2.07 MB

english, 2016

2

Effects of Trace Phosphorus in Sn-Cu-Ni Wave Solder Dross

Nogita, Kazuhiro, Mohd Salleh, Mohd Arif Anuar, Tran, Xuan Q., Read, Jonathan, Smith, Selena, McDonald, Stuart D.

Journal:

Materials Science Forum

Année:

2016

Langue:

english

Fichier:

PDF, 538 KB

english, 2016

3

An Investigation of TiO 2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite

Saud, Norainiza, Mohd Said, Rita, Mohd Salleh, Mohd Arif Anuar, Derman, Mohd Nazree, Ramli, Mohd Izrul Izwan, Mohd Nasir, Norhayanti, Sharif, S., Abdullah, M.M.A.B., Abd Rahim, S.Z., Ghazali, M.F., Ma

Journal:

MATEC Web of Conferences

Année:

2016

Langue:

english

Fichier:

PDF, 951 KB

english, 2016

4

Synthesis and Characterization of Ag/TiO2 Thin Film via Sol-Gel Method

Halin, Dewi Suriyani Che, Mahmed, Norsuria, Mohd Salleh, Mohd Arif Anuar, Mohd Sakeri, A.N., Abdul Razak, Kamrosni

Journal:

Solid State Phenomena

Année:

2018

Langue:

english

Fichier:

PDF, 826 KB

english, 2018

5

Bonding Strength Characteristics of FA-Based Geopolymer Paste as a Repair Material When Applied on OPC Substrate

Ahmad Zailani, Warid Wazien, Bouaissi, Aissa, Abdullah, Mohd Mustafa Al Bakri, Abd Razak, Rafiza, Yoriya, Sorachon, Mohd Salleh, Mohd Arif Anuar, Rozainy M. A. Z., Mohd Remy, Fansuri, Hamzah

Journal:

Applied Sciences

Année:

2020

Fichier:

PDF, 2.61 MB

2020

6

FT-IR and Morphology of Different Recycled Acrylonitrile-Butadiene Rubber Glove (NBRgr) Size and its Blend Ratios of SBR/NBRr Blends

Lokman Hakim, I., Noriman, Nik Zulkepli, Hanafi, Ismail, Sam, S.T., Mohd Salleh, Mohd Arif Anuar, Rosniza, Hamzah

Journal:

Advanced Materials Research

Année:

2012

Langue:

english

Fichier:

PDF, 2.57 MB

english, 2012

7

The Effect of Dipping Time to the Intermetallic Compound and Free Solder Thickness of Sn-Cu-Ni (SN100C) Lead-Free Solder Coating

Mohd Sobri, Fatin Afeeqa, Mohd Salleh, Mohd Arif Anuar, Ruzaidi, Che Mohd, Narayanan, Pavithiran

Journal:

Applied Mechanics and Materials

Année:

2015

Langue:

english

Fichier:

PDF, 322 KB

english, 2015

8

Effect of TiO2 on the Formation of Primary and Interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni Solder Paste during Soldering

Mohd Salleh, Mohd Arif Anuar, Said, R.M., Saud, Norainiza, Yasuda, H., McDonald, S.D., Nogita, K.

Journal:

Key Engineering Materials

Année:

2016

Langue:

english

Fichier:

PDF, 1.76 MB

english, 2016

9

Effect of Annealing Temperature on Silver Doped Titanium Dioxide (Ag/TiO2) Thin Film via Sol-Gel Method

Razak, Kamrosni Abdul, Che Halin, Dewi Suriyani, Al Bakri, Mohd Mustafa Abdullah, Salleh, Mohd Arif Anuar Mohd, Mahmed, Norsuria, Danial, N.S.

Journal:

Solid State Phenomena

Année:

2018

Langue:

english

Fichier:

PDF, 924 KB

english, 2018

10

Corrosion Protection Of Mild Steel In Sea Water Using Chemical Inhibitor

Araoyinbo, Alaba O., Mohd Salleh, Mohd Arif Anuar, Jusof, Muhammad Zulerwan

Journal:

IOP Conference Series Materials Science and Engineering

Année:

2018

Langue:

english

Fichier:

PDF, 466 KB

english, 2018

11

Microstructure Evolution of Sn-Cu Based Solder Paste with Different Cu Concentration Subjected to Multiple Reflows

Said, Rita Mohd, Salleh, Mohd Arif Anuar Mohd, Amran, Nur Ain Athirah, Ramli, Mohd Izrul Izwan

Journal:

Solid State Phenomena

Année:

2018

Langue:

english

Fichier:

PDF, 1.29 MB

english, 2018

12

Tin (Sn) whisker growth from electroplated Sn finished

Hashim, Aimi Noorliyana, Salleh, Mohd Arif Anuar Mohd, Mokhtar, Noor Zaimah Mohd, Idris, Shahida

Journal:

IOP Conference Series Materials Science and Engineering

Année:

2019

Fichier:

PDF, 565 KB

2019

13

Influence of Thermal Aging on Lead-Free Solder Joints Reliability: A Review

May Shin, Chang, Arif Anuar Mohd Salleh, Mohd, Suriyani Che Halin, Dewi

Journal:

IOP Conference Series Materials Science and Engineering

Année:

2020

Fichier:

PDF, 249 KB

2020

14

Zn-Sn Based High Temperature Solder - A Short Review

Musa, Sayyidah Amnah, Mohd Salleh, Mohd Arif Anuar, Norainiza, Saud

Journal:

Advanced Materials Research

Année:

2013

Langue:

english

Fichier:

PDF, 266 KB

english, 2013

15

[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Solder microstructure and intermetallic interface evaluation between Sn-3.5Ag-1.0Cu-xNi lead free solder under long time thermal aging (x: 0, 0.05, 0.2, 0.5)

Ghani, Noor Asikin Ab, Yahya, Iziana, Salleh, Mohd Arif Anuar Mohd, Shamsuddin, Saidatulakmar, Ahmad, Zainal Ariffin, Mayappan, Ramani

Année:

2012

Langue:

english

Fichier:

PDF, 1.69 MB

english, 2012

16

[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Intermetallic evolution between Sn-3.5Ag-1.0Cu-xZn lead free solder and copper substrate under long time thermal aging (x: 0, 0.1, 0.4, 0.7)

Yahya, Iziana, Ghani, Noor Asikin Ab, Salleh, Mohd Arif Anuar Mohd, Hamid, Hamidi Abd, Ahmad, Zainal Ariffin, Mayappan, Ramani

Année:

2012

Langue:

english

Fichier:

PDF, 1.35 MB

english, 2012

17

Hybrid Microwave-Assisted Rapid Sintering Process for Fabrication of Sn-0.7Cu+1.0wt.%Si3N4 Composite Solder

Somidin, Flora, Saud, Norainiza, Mohd Salleh, Mohd Arif Anuar

Journal:

Materials Science Forum

Année:

2014

Langue:

english

Fichier:

PDF, 330 KB

english, 2014

18

Characterization of Sn-3.5Ag-1.0Cu Lead-Free Solder Prepared via Powder Metallurgy Method

Yahya, Iziana, Ab Ghani, Noor Asikin, Mohd Salleh, Mohd Arif Anuar, Abd Hamid, Hamidi, Ahmad, Zainal Arifin, Mayappan, Ramani

Journal:

Advanced Materials Research

Année:

2012

Langue:

english

Fichier:

PDF, 279 KB

english, 2012

19

Wettability, Electrical and Mechanical Properties of 99.3Sn-0.7Cu/Si3N4 Novel Lead-Free Nanocomposite Solder

Mohd Salleh, Mohd Arif Anuar, Hafiz Hazizi, Muhammad, Ahmad, Zainal Arifin, Hussin, Kamarudin, Ahmad, Khairel Rafezi

Journal:

Advanced Materials Research

Année:

2011

Langue:

english

Fichier:

PDF, 1.47 MB

english, 2011

20

Effect of TiO2 Reinforcement on Microstructure and Microhardness of Low-Silver SAC107 Lead-Free Solder Composite Solder

Nasir, Norhayanti Mohd, Saud, Norainiza, Nazree Derman, Mohd, Salleh, Arif Anuar Mohd, Ramli, Mohd Izrul Izwan, Said, Rita Mohd

Journal:

Materials Science Forum

Année:

2014

Langue:

english

Fichier:

PDF, 223 KB

english, 2014

21

Research Advances of Composite Solder Material Fabricated via Powder Metallurgy Route

Mohd Salleh, Mohd Arif Anuar, Hazizi, Muhammad Hafiz, Mustafa Al Bakri, Abdullah Mohd, Noriman, N.Z., Mayapan, Ramani, Ahmad, Zainal A.

Journal:

Advanced Materials Research

Année:

2012

Langue:

english

Fichier:

PDF, 292 KB

english, 2012

22

Natural Rubber/Styrene Butadiene Rubber/Recycled Nitrile Glove (NR/SBR/rNBRg) Ternary Blend: Curing Characteristics and Swelling Test

Nik Yahya, Nik Zakaria, Zulkepli, Nik Noriman, Ismail, Hanafi, Salleh, Mohd Arif Anuar Mohd, Ragunathan, Santiagoo

Journal:

Key Engineering Materials

Année:

2013

Langue:

english

Fichier:

PDF, 771 KB

english, 2013

23

Study on the Properties of Oil Palm Trunk Fiber (OPTF) in Cement Composite

Abdullah, Alida, Abdullah, Mohd Mustafa Al Bakri, Hussin, Kamarudin, Ghazali, Che Mohd Ruzaidi, Salleh, Mohd Arif Anuar Mohd, Sang, Phang Kam, Muhammad Faheem, M.T.

Journal:

Applied Mechanics and Materials

Année:

2013

Langue:

english

Fichier:

PDF, 221 KB

english, 2013

24

Metallurgical Failure Analysis of a Closed Recirculation System Water Cooling Pipe

Mohd Salleh, Mohd Arif Anuar, Shamsudin, Shaiful Rizam, Kamardin, Azmi, Hassan, Hafizan, Noor, Noor Hamidi Mohd

Journal:

Advanced Materials Research

Année:

2013

Langue:

english

Fichier:

PDF, 627 KB

english, 2013

25

Effects of Recycled-Aluminum Additions on the Mechanical Properties of Sn-0.7Cu/Cu-Substrate Lead-Free Solder Joints

Mohd Salleh, Mohd Arif Anuar, Somidin, Flora, Mustafa Al Bakri, Abdullah Mohd, Noriman, N.Z., Mayappan, Ramani, Alui, Noor Farhani Mohd

Journal:

Advanced Materials Research

Année:

2013

Langue:

english

Fichier:

PDF, 413 KB

english, 2013

26

Overview of Pathogenic Micro-Organisms Destruction in Contaminated Water by Oxide Photocatalysis

Azira, N.M.N., Idris, M. Asri, Halin, Dewi Suriyani Che, Derman, M.N.B., Mohd Salleh, Mohd Arif Anuar

Journal:

Advanced Materials Research

Année:

2013

Langue:

english

Fichier:

PDF, 455 KB

english, 2013

27

Alteration of Solution Treatment Condition to the Precipitation Behavior A319 Alloy

Murizam, D., Jamaludin, Shamsul Baharin, Salleh, Mohd Arif Anuar Mohd, Faizul, C.P., Ruhiyuddin, M.Z.

Journal:

Advanced Materials Research

Année:

2013

Langue:

english

Fichier:

PDF, 479 KB

english, 2013

28

The Effect of Silicon Nitride Addition on Microstructure and Microhardness of SN100C Solder Alloy Using Powder Metallurgy

Ramli, Mohd Izrullzwan, Saud, Norainiza, Mohd Salleh, Mohd Arif Anuar, Nazree Derman, Mohd, Mohd Said, Rita, Nasir, Norhayanti

Journal:

Materials Science Forum

Année:

2014

Langue:

english

Fichier:

PDF, 319 KB

english, 2014

29

The Effects of Tensile and Morphological Properties of Styrene Butadiene Rubber/Recycled Chloroprene Rubber (SBR/CRr) Blends

Azrem, Ahmad A., Noriman, N.Z., Razif, M.N., Mohd Salleh, Mohd Arif Anuar

Journal:

Advanced Materials Research

Année:

2012

Langue:

english

Fichier:

PDF, 637 KB

english, 2012

30

Effect of Aging Temperature on the Intermetallic Compound (IMC) Formation of Sn-0.7Cu/Si3N4 Composite Solder

Najib, S.I., Mohd Salleh, Mohd Arif Anuar, Norainiza, Saud

Journal:

Advanced Materials Research

Année:

2013

Langue:

english

Fichier:

PDF, 506 KB

english, 2013

31

Failure Investigation on Rusty Mesh Strainer of Petrochemical Plant

Shamsudin, Shaiful Rizam, Harun, Mohd, Mohd Salleh, Mohd Arif Anuar, Yazid, Hafizal, Mazlee, Mohd Noor

Journal:

Advanced Materials Research

Année:

2013

Langue:

english

Fichier:

PDF, 449 KB

english, 2013

32

Compressive Strength and Morphology of Fly Ash Based Geopolymer as Artificial Aggregate with Different Curing Temperature

Abdullah, Alida, Al Bakri, Abdullah Mohd Mustafa, Kamarudin, Hussin, Ruzaidi, C.M., Zarina, Yahya, Mohd Salleh, Mohd Arif Anuar, Zakaria, Nurhamidah, Muhammad Faheem, Md Tahir

Journal:

Key Engineering Materials

Année:

2013

Langue:

english

Fichier:

PDF, 351 KB

english, 2013

33

Microstructure Evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu System Lead Free Solder under Long Term Thermal Aging

Ab Ghani, Noor Asikin, Yahya, Iziana, Mohd Salleh, Mohd Arif Anuar, Saidatulakmar, Shamsuddin, Ahmad, Zainal Arifin, Mayappan, Ramani

Journal:

Advanced Materials Research

Année:

2012

Langue:

english

Fichier:

PDF, 1.37 MB

english, 2012

34

Intermetallic Compound Formation on Solder Alloy/Cu-Substrate Interface Using Lead-Free Sn-0.7Cu/Recycled-Aluminum Composite Solder

Somidin, Flora, Mohd Salleh, Mohd Arif Anuar, Ahmad, Khairel Rafezi

Journal:

Advanced Materials Research

Année:

2012

Langue:

english

Fichier:

PDF, 541 KB

english, 2012

35

Research Development of Solder Materials and its Intermetallic Compound (IMC) Study

Mohd Salleh, Mohd Arif Anuar, Ibrahim, N.S., Saud, N., Mustafa Al Bakri, A. M., Noriman, N.Z., Mayapan, Ramani, Ahmad, Z.A.

Journal:

Advanced Materials Research

Année:

2012

Langue:

english

Fichier:

PDF, 264 KB

english, 2012

36

Preparation of Cyclopentyl Trisilanol Silsesquioxanes - Modified Natural Rubber (CpSSQ(OH)3 ENR-50) Composite Hybrid in the Presence of HCL Acid

Hamzah, Rosniza, Bakar, Mohamad Abu, Zulkepli, Nik Noriman, Salleh, Mohd Arif Anuar Mohd, Mustafa Al Bakri, Abdullah Mohd

Journal:

Advanced Materials Research

Année:

2013

Langue:

english

Fichier:

PDF, 415 KB

english, 2013

37

Effect of Aging Time towards Intermetallic Compound (IMC) Growth Kinetics Formation for Sn-0.7Cu-Si3N4 Composite Solder on Copper Substrate

Najib, S.I., Mohd Salleh, Mohd Arif Anuar, Norainiza, Saud

Journal:

Advanced Materials Research

Année:

2013

Langue:

english

Fichier:

PDF, 285 KB

english, 2013

38

Sn-Cu-Ni (SN100C) Lead-Free Solder Coating Wettability Study

Mohd Sobri, Fatin Afeeqa, Mohd Salleh, Mohd Arif Anuar, Ruzaidi Ghazali, Che Mohd, Narayanan, Pavithiran

Journal:

Applied Mechanics and Materials

Année:

2015

Langue:

english

Fichier:

PDF, 289 KB

english, 2015

39

Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste

Mohd Said, Rita, Saud, Norainiza, Mohd Salleh, Mohd Arif Anuar, Derman, Mohd Nazree, Izwan Ramli, Mohd Izrul, Nasir, Norhayanti Mohd

Journal:

Applied Mechanics and Materials

Année:

2015

Langue:

english

Fichier:

PDF, 363 KB

english, 2015

40

Formation of Kirkendall Voids at Low and High Aging Temperature in the Sn-0.7Cu-1.0wt.%Si3N4/Cu Solder Joints

Saud, Norainiza, Somidin, Flora, Ibrahim, Najib Saedi, Mohd Salleh, Mohd Arif Anuar

Journal:

Advanced Materials Research

Année:

2015

Langue:

english

Fichier:

PDF, 545 KB

english, 2015

41

The Influence of Activated Carbon (AC) on Melting Temperature, Wettability and Intermetallic Compound Formation of Sn-Cu-Ni (SN100C) Solder Paste

Mohd Said, Rita, Saud, Norainiza, Mohd Salleh, Mohd Arif Anuar, Derman, Mohd Nazree, Izwan Ramli, Mohd Izrul, Nasir, Norhayanti Mohd

Journal:

Applied Mechanics and Materials

Année:

2015

Langue:

english

Fichier:

PDF, 373 KB

english, 2015

42

Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni Solders

Gourlay, C.M., Ma, Zhao Long, Xian, Jing Wei, Belyakov, Sergey A., Mohd Salleh, Mohd Arif Anuar, Zeng, Guang, Yasuda, Hideyuki, Nogita, Kazuhiro

Journal:

Materials Science Forum

Année:

2016

Langue:

english

Fichier:

PDF, 2.54 MB

english, 2016

43

Extraction of Tin (Sn) from Solder Dross by Using Citric Acid Leaching Treatment

Ismail, Syarifah Aminah, Jamil, Noorina Hidayu, Hussin, Kamarudin, Mohd Salleh, Mohd Arif Anuar

Journal:

Applied Mechanics and Materials

Année:

2015

Langue:

english

Fichier:

PDF, 381 KB

english, 2015

44

Improvement of Sn-0.7Cu Lead Free Solder Joints on Shear Strength with Addition of Titanium Oxide (TiO2) Particles

Nasir, Norhayanti Mohd, Saud, Norainiza, Mohd Salleh, Mohd Arif Anuar, Derman, Mohd Nazree, Ramli, Mohd Izrul Izwan, Mohd Said, Rita

Journal:

Materials Science Forum

Année:

2016

Langue:

english

Fichier:

PDF, 319 KB

english, 2016

45

Solderability and Interfacial Intermetallic Compound (IMC) Growth of Sn-Cu-Ni Solder with Additions of Germanium

Mohd Sobri, Fatin Afeeqa, Mohd Salleh, Mohd Arif Anuar, Ghazali, Che Mohd Ruzaidi, Narayanan, Pavithiran

Journal:

Materials Science Forum

Année:

2016

Langue:

english

Fichier:

PDF, 1.67 MB

english, 2016

46

Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si3N4) Reinforcement

Izwan Ramli, Mohd Izrul, Saud, Norainiza, Mohd Salleh, Mohd Arif Anuar, Derman, Mohd Nazree, Mohd Said, Rita, Nasir, Norhayanti

Journal:

Applied Mechanics and Materials

Année:

2015

Langue:

english

Fichier:

PDF, 434 KB

english, 2015

47

Effect of Si3N4 Addition on the Properties of Sn-1.0Ag-0.7Cu Solder Alloy

Nasir, Norhayanti Mohd, Saud, Norainiza, Mohd Salleh, Mohd Arif Anuar, Nazree Derman, Mohd, Izwan Ramli, Mohd Izrul, Mohd Said, Rita

Journal:

Materials Science Forum

Année:

2015

Langue:

english

Fichier:

PDF, 339 KB

english, 2015

48

Influence of Silicon Nitride (Si3N4) Addition on Microstructure, Mechanical and Thermal Properties of Sn-0.7Cu Lead-Free Solder

Nasir, Norhayanti Mohd, Saud, Norainiza, Mohd Salleh, Mohd Arif Anuar, Derman, M.N., Izwan Ramli, Mohd Izrul, Mohd Said, Rita

Journal:

Applied Mechanics and Materials

Année:

2015

Langue:

english

Fichier:

PDF, 277 KB

english, 2015

49

Extraction of Tin (Sn) from Solder Dross by Using Hydrochloric Acid Leaching Treatment

Ismail, Syarifah Aminah, Jamil, Noorina Hidayu, Hussin, Kamarudin, Mohd Salleh, Mohd Arif Anuar

Journal:

Applied Mechanics and Materials

Année:

2015

Langue:

english

Fichier:

PDF, 609 KB

english, 2015

50

Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste

Mohd Said, Rita, Mohd Salleh, Mohd Arif Anuar, Derman, Mohd Nazree, Ramli, Mohd Izrul Izwan, Nasir, Norhayanti Mohd, Saud, Norainiza

Journal:

Key Engineering Materials

Année:

2016

Langue:

english

Fichier:

PDF, 608 KB

english, 2016